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TDA6108AJF
Triple video output amplifier
Rev. 03 -- 20 April 2005 Product data sheet
1. General description
The TDA6108AJF contains three video output amplifiers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. To obtain maximum performance, the amplifier should be used with black-current control.
2. Features
s s s s s s s s Typical bandwidth of 9.0 MHz for an output signal of 60 V (p-p) High slew rate of 1310 V/s No external components required Very simple application Single supply voltage of 200 V Internal reference voltage of 2.5 V Fixed gain of 81 Black-Current Stabilization (BCS) circuit with voltage window from 1.5 V to 6 V and current window from +100 A to -10 mA s Thermal protection
3. Ordering information
Table 1: Ordering information Package Name TDA6108AJF DBS9MPF Description plastic DIL-bent-SIL medium power package with fin; 9 leads Version SOT111-1 Type number
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
4. Block diagram
VDD 6 MIRROR 1 MIRROR 5
TDA6108AJF
CASCODE 1
MIRROR 4 CURRENT SOURCE 1x THERMAL PROTECTION CIRCUIT Vi(1), Vi(2), Vi(3)
3x
1x 9, 8, 7 Voc(1), Voc(2), Voc(3)
Rf
VIP REFERENCE
DIFFERENTIAL STAGE
1, 2, 3
Ri Ra
MIRROR 3
5
Iom
3x
CASCODE 2
MIRROR 2 4
mce462
Fig 1. Block diagram
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Product data sheet
Rev. 03 -- 20 April 2005
2 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
5. Pinning information
5.1 Pinning
Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1)
1 2 3 4 5 TDA6108AJF 6 7 8 9
001aac594
Fig 2. Pin configuration
5.2 Pin description
Table 2: Symbol Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1) Pin description Pin 1 2 3 4 5 6 7 8 9 Description inverting input 1 inverting input 2 inverting input 3 ground black-current measurement output supply voltage cathode output 3 cathode output 2 cathode output 1
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Product data sheet
Rev. 03 -- 20 April 2005
3 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
6. Internal circuitry
GND to cascode stage 1, 2, 3 4 VDD 6 to black-current measurement circuit
TDA6108AJF
(1)
esd
from input circuit esd to black-current measurement circuit from control circuit from input circuit Vbias
esd esd
flash 7, 8, 9
5 esd 6.8 V
from blackcurrent measurement circuit from control circuit
esd
to black-current measurement circuit
to black-current measurement circuit
mce465
(1) All pins have an energy protection for positive or negative overstress situations.
Fig 3. Internal pin configuration
7. Limiting values
Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specified in Figure 9; unless otherwise specified. Symbol VDD Vi Vom |Iom(mean)| Voc Tstg Tj Vesd Parameter supply voltage input voltage at pins Vi(1), Vi(2) and Vi(3) measurement output voltage absolute value of mean current of measurement output (for three channels) cathode output voltage storage temperature junction temperature electrostatic discharge voltage Human Body Model (HBM) Machine Model (MM) Voc = 0 V to VDD; Vom = 1.5 V to 6 V Conditions Min 0 0 0 0 -55 -20 Max 250 12 6 5.6 VDD +150 +150 3000 300 Unit V V V mA V C C V V
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Product data sheet
Rev. 03 -- 20 April 2005
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Philips Semiconductors
TDA6108AJF
Triple video output amplifier
8. Thermal characteristics
Table 4: Symbol Rth(j-a) Rth(j-fin)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to fin Conditions in free air
[1]
Typ 56 11
Unit K/W K/W
An external heatsink is necessary; see Application Note AN10227-01.
8 Ptot (W) 6
(1)
mbh989
4
(2)
2
0 -40
0
40
80
120 160 Tamb (C)
(1) Infinite heatsink. (2) No heatsink.
Fig 4. Power derating curve
8.1 Thermal protection
The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130 C and 30 % decrease at 145 C (typical values on the spot of the thermal protection circuit).
outputs 5 K/W thermal protection circuit 6 K/W fin
mgk279
Fig 5. Equivalent thermal resistance network
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(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
5 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
9. Characteristics
Table 5: Characteristics Operating range: Tj = -20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 0.5VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specified. Symbol Iq Vref(int) Ri G G PSRR ct(DC) Vom(clamp) Iom(offset) Iom/Ioc Parameter quiescent supply current internal reference voltage (input stage) input resistance gain of amplifier gain difference power supply rejection ratio DC crosstalk between channels clamping voltage of measurement output offset current of measurement output (for three channels) linearity of current transfer (for three channels) Ioc = 0 A; Vom = 1.5 V to 6 V Ioc = -100 A to +100 A; Vom = 1.5 V to 6 V Ioc = -100 A to +10 mA; Vom = 1.5 V to 4 V Output pins Voc(1), Voc(2), Voc(3) Voc(DC) Voc(DC)(offset) Voc(T) Voc(T)(offset) DC output voltage Ii = 0 A 76 -5 87 0 10 0 97 +5 V V mV/K mV/K differential DC output offset Ii = 0 A voltage between two output pins output voltage temperature drift differential output offset voltage temperature drift between two output pins maximum peak output current minimum output voltage maximum output voltage small signal bandwidth large signal bandwidth Voc = 50 V to VDD - 50 V Vi = 4.5 V; at Ioc = 0 mA Vi = 0.5 V; at Ioc = 0 mA Voc = 60 V (p-p) Voc = 100 V (p-p)
[3] [2] [2]
Conditions
Min 7.9 73 -4.2
Typ 9.4 2.5 2.1 81 0 65 -50 -1.0 -1.0
Max 10.8 89 +4.2 10 +50 -1.1 -1.1
Unit mA V k
f < 50 kHz
[1]
6 -50 -0.9 -0.9
dB dB V A
Measurement output pin Iom; Voc = Voc(min) to Voc(max)
Ioc(max) Voc(min) Voc(max) BS BL toc(p) toc(p)
-10
28 9.0 8.0 32 0
10 +10
mA V V MHz MHz ns ns
VDD - 15 -
cathode output propagation time Voc = 100 V (p-p) square 50 % input to 50 % output wave difference in cathode output propagation time 50 % input to 50 % output (between two output pins) cathode output rise time 10 % output to 90 % output cathode output fall time 90 % output to 10 % output Voc = 100 V (p-p) square wave
[3]
toc(r) toc(f)
Voc = 50 V to 150 V square wave Voc = 150 V to 50 V square wave
[3]
35 35
50 50
70 65
ns ns
[3]
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Product data sheet
Rev. 03 -- 20 April 2005
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Philips Semiconductors
TDA6108AJF
Triple video output amplifier
Table 5: Characteristics ...continued Operating range: Tj = -20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 0.5VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specified. Symbol tst SR Ov Parameter settling time input (50 %) to output (99 % to 101 %) slew rate between 50 V to VDD - 50 V cathode output voltage overshoot Conditions Voc = 100 V (p-p) square wave Voc = 2.5 V (p-p) square wave Voc = 100 V (p-p) square wave
[3]
Min -
Typ 1310 10
Max 350 -
Unit ns V/s %
[3]
[3]
[1] [2] [3]
The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. See Figure 6 for the typical DC-to-DC transfer of Vi to Voc. f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)] see Figure 7 and Figure 8.
200 Voc (V) 160
mce455
120
80
40
0 0 1 2 3 Vi (V) 4
Fig 6. Typical DC-to-DC transfer of Vi to Voc
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(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
7 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
2.96 Vi (V)
2.34 t
1.73
tst Ov (in %) 150 140 Voc (V) 100 149 151
60 50
t toc(r) tco(p)
mce477
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edges as a function of the AC input signal
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
8 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
2.96 Vi (V)
2.34 t
1.73
tst
150 140 Voc (V) 100 Ov (in %) 60 50 49 t toc(f) tco(p)
mce476
51
Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edges as a function of the AC input signal
10. Application information
10.1 Flashover protection
For sufficient flashover protection it is necessary to apply an external diode and 100 resistor for each channel; see Application Note AN10227-01. To limit the diode current an external 1 k carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB). VDD must be decoupled to GND: 1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDD and GND and must be within 5 mm 2. With a capacitor > 3.3 F on the picture tube base print, depending on the CRT size.
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
9 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
10.2 Switch-off behavior
The switch-off behavior of the TDA6108AJF is controllable. This is because the output pins of the TDA6108AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher).
10.3 Bandwidth
The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times.
10.4 Dissipation
A distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6108AJF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: Pstat = VDD x IDD + 3 x Voc x Ioc Where: VDD = supply voltage IDD = supply current Voc = DC value of cathode output voltage Ioc = DC value of cathode output current. The dynamic dissipation Pdyn equals: Pdyn = 3 x VDD x (CL + Cint) x fi x Voc(p-p) x Where: CL = load capacitance Cint = internal load capacitance (4 pF) fi = input frequency Voc(p-p) = cathode output voltage (peak-to-peak value) = non-blanking duty factor. The TDA6108AJF must be mounted on the picture tube base print to minimize the load capacitance.
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
10 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
11. Test information
VDD C1 22 F C2 Ra 22 nF J1 Vi(1) 1 Ri 1 Iom C9 3.2 pF J2 Vi(2) 2 Ri 2 Ra 22 nF Iom C12 3.2 pF J3 Vi(3) 3 Ri 3 Ra 22 nF C15 3.2 pF VIP REFERENCE 5 Iom C17 136 pF R6 100 k C14 136 pF R4 100 k C11 136 pF R2 100 k Rf Vof 6 C7 20 nF C8 10 F
9 Voc(1) C10 6.8 pF R1 2 M probe 1
C3 22 F C4
Rf Vof
8 Voc(2) C13 6.8 pF R3 2 M probe 2
C5 22 F C6
Rf Vof
7 Voc(3) C16 6.8 pF R5 2 M probe 3
TDA6108AJF
4 GND
Vom 4V
mce464
Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.
Fig 9. Test circuit
11.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
11 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
12. Package outline
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1
D
D1 q P P1 Q A2
A3 q1 q2
A A4 seating plane pin 1 index
E
L 1 Z b2 e b b1 wM 9
c
e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT111-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q q q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1
65o o 55
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
1.75 15.1 1.55 14.9
ISSUE DATE 95-03-11 03-03-12
Fig 10. Package outline SOT111-1 (DBS9MPF)
9397 750 14729 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
12 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
13. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits.
14. Soldering
14.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
14.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
14.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 C and 400 C, contact may be up to 5 seconds.
14.4 Package related soldering information
Table 6: Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP [2]
[1] [2]
Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping - suitable - Wave suitable suitable [1] not suitable
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
13 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
15. Revision history
Table 7: Revision history Release date 20050420 Data sheet status Product data sheet Change notice Doc. number 9397 750 14729 Supersedes TDA6108AJF_2 Document ID TDA6108AJF_3 Modifications: TDA6108AJF_2 Modifications:
*
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors Preliminary specification 9397 750 13498 TDA6108AJF_1
040630
* * * *
In Features: change of slew rate In Limiting values; change to ESD In Characteristics; change of value for output measurement pin In Characteristics; change of value for slew rate and cathode output rise time Preliminary specification 9397 750 11633 -
TDA6108AJF_1
030919
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(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
14 of 16
Philips Semiconductors
TDA6108AJF
Triple video output amplifier
16. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14729
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 20 April 2005
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Philips Semiconductors
TDA6108AJF
Triple video output amplifier
20. Contents
1 2 3 4 5 5.1 5.2 6 7 8 8.1 9 10 10.1 10.2 10.3 10.4 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 9 Flashover protection . . . . . . . . . . . . . . . . . . . . . 9 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Quality information . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering by dipping or by solder wave . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 20 April 2005 Document number: 9397 750 14729
Published in The Netherlands

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